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mpxh6400a rev 4, 11/2009 freescale semiconductor ? freescale semiconductor, inc. , 2007-2009. all rights reserved. pressure h igh temperature accuracy integrated silicon pressure sensor for measuring absolute pressure, on-chip signal conditioned, temperature compensated and calibrated the freescale mpxxx6400a series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networ ks to provide a high output signal and temperature compensation. the small form factor and high reliability of on-chip integration make the freescale pressure sensor a logical and economical choice for the system designer. the mpxxx6400a series piezoresistive transducer is a state-of-the-art, monolithic, signal conditio ned, silicon pressure sensor. this sensor combines advanced micromachining techniques, th in film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. features ? improved accuracy at high temperature ? available in small and super small outline packages ? 1.5% maximum error over 0 to 85 c ? ideally suited for mi croprocessor or microcontroller-based systems ? temperature compensated from -40 to +125 c ? durable thermoplastic ( pps) surface mount package ordering information device name package options case no. # of ports pressure type device marking none single dual gauge differential absolute small outline package (mpxa6400a series) mpxa6400ap tray 1369 ? ? mpxa6400a super small outline package (mpxh6400a series) mpxh6400ac6u rails 1317a ? ? mpxh6400a MPXH6400AC6T1 tape and reel 1317a ? ? mpxh6400a super small outline package (media resistant gel) (mpxhz6400a series) mpxhz6400ac6t1 tape and reel 1317a ? ? mpxhz6400a mpxa6400a 20 to 400 kpa (3.0 to 58 psi) 0.2 to 4.8 v output mpxh6400a mpxhz6400a series super small outline package mpxh6400ac6u/c6t1 mpxhz6400ac6t1 case 1317a-04 mpxa6400ap case 1369-01 small outline package application examples ? industrial controls ? engine control/manifold absolute pressure (map)/liquefied petroleum gas (lpg)
mpxh6400a sensors 2 freescale semiconductor pressure operating characteristics (v s = 10 vdc, t a = 25 c unless otherwise noted, p1 > p2) characteristic symbol min typ max unit pressure range p op 20 ? 400 kpa supply voltage (1) v s 4.64 5.0 5.36 vdc supply current i o ? 6.0 10 madc minimum pressure offset (0 to 85 c) @ v s = 5.0 volts (2) v off 0.133 0.2 0.267 vdc full scale output (0 to 85 c) @ v s = 5.0 volts (3) v fso 4.733 4.8 4.866 vdc full scale span (0 to 85 c) @ v s = 5.0 volts (4) v fss 4.467 4.6 4.733 vdc accuracy (5) (0 to 85 c) ??? 1.5 %v fss sensitivity v/p ? 12.1 ? mv/kpa response time (6) t r ?1.0?ms warm-up time (7) ??20?ms offset stability (8) ?? 0.25 ? %v fss 1. device is ratiometric within this specified excitation range. 2. offset (v off ) is defined as the output voltage at the minimum rated pressure. 3. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. 4. full scale span (v fss ) is defined as the algebraic difference between the output volt age at full rated pressure and the output voltage at the minimum rated pressure. 5. accuracy is the deviation in actual out put from nominal output over the entire pressure range and temperature range as a perc ent of span at 25 c due to all sources of error including the following: linearity:output deviation from a straight line relations hip with pressure over t he specified pressure range. temperature hysteresis: output deviation at any temperature within the operating tem perature range, after the temperature is cy cled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. pressure hysteresis: output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 c. tcspan: output deviation over the temperature range of 0 to 85 c, relative to 25 c. tcoffset: output deviation with minimum rated pressu re applied, over the temperature range of 0 to 85 c, relative to 25 c. variation from nominal: the variation from nominal val ues, for offset or full scal e span, as a percent of v fss , at 25 c. 6. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. 7. warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. offset stability is the product's output deviation when subjected to 1000 hours of pu lsed pressure, temperature cycling with bias test.
mpxh6400a sensors freescale semiconductor 3 pressure maximum ratings (1) 1. exposure beyond the specified limits may c ause permanent damage or degradation to the device. rating symbol value unit maximum pressure (p1 > p2) p max 1600 kpa storage temperature t stg -40 to +125 c operating temperature t a -40 to +125 c output source current @ full scale output (2) 2. maximum output current is cont rolled by effective impedance from v out to gnd or v out to v s in the application circuit. figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. figure 1. fully integrated pressure sensor schematic i o +0.5madc output sink current @ minimum pressure offset (2) i o --0.5madc 2 v s 4 v out 3 gnd sensing element pins 1, 5, 6, 7, and 8 are no connects for small outline package and super small thin film temperature compensation and gain stage #1 gain stage #2 and ground reference shift circuitry outline package devices.
mpxh6400a sensors 4 freescale semiconductor pressure figure 1 illustrates the absolute sensing chip in the basic super small outline chip carrier (case 1317). figure 2. illustrates a typical application circuit (output source current operation). figure 3. shows the sensor output signal relative to pressure input. typical minimum and maximum output curves are shown for operation over 0 to 85 c temperature range. the output will saturate outside of the rated pressure range. a fluorosilicone gel isolates the die surface and wire bonds from the environment, while a llowing the pressure signal to be transmitted to the silicon diaphragm. the mpxxx6400a series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. media other than dry air may have adverse effects on sensor performance and long-term reliability. contact the factory for information regarding media compatibility in your application. figure 1. cross sectional diagram ssop (not to scale) figure 2. typical application circuit (output source current operation) figure 3. output vs. absolute pressure fluoro silicone gel die coat wire bond lead frame sealed vacuum reference absolute element die bond stainless steel cap thermoplastic case p1 die v s pin 2 + 5.0 v gnd pin 3 v out pin 4 mpxxx6400a to adc 100 nf 51 k 47 pf output (volts) pressure (reference to sealed vacuum) in kpa 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400 transfer function: v out = v s x (0.002421xp?0.00842 error v s = 5.0 v dc temperature = 0 to 85c min typ max 4.5 0 4.0 5.0 1.0 1.5 2.0 2.5 3.0 3.5 0.5
mpxh6400a sensors freescale semiconductor 5 pressure transfer function (mpxxx6400a) normal transfer value: v out = v s x (0.002421 x p ? 0.00842) pressure error x temp. factor x 0.002421 x v s v s = 5.0 0.36 v dc break points temp multiplier - 40 3 0 to 85 1 1 2 5 1 . 7 5 temperature in c 4.0 3.0 2.0 0.0 1.0 -40 -20 0 20 40 60 140 120 100 80 temperature error factor note: the temperature multiplier is a linear response from 0c to -40c and from 85c to 125c mpxxx6400a series temperature error band error limits for pressure 5.5 (kpa) 3.0 2.0 1.0 -1.0 -2.0 -4.0 0.0 4.0 -3.0 - 5.0 - 6.0 5.0 6.0 20 pressure (in kpa) pressure error (kpa) pressure error (max) 20 to 400 (kpa) 5.5 (kpa) 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400 pressure error band
mpxh6400a sensors 6 freescale semiconductor pressure pressure (p1)/vacuum (p2) side identification table the two sides of the pressure sensor are designated as the pressure (p1) side and the vacuum (p2) side. the pressure (p1) side is the side containing fluorosilicone gel, which protects the die from harsh media. the mpx pressure sensor is designed to operat e with positive differential pressure applied, p1 > p2. the pressure (p1) side may be identified by using the following table: surface mounting information minimum recommended footprint for small outline package surface mount board layout is a critical portion of the total design. the footprint for the su rface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. with the correct footprint, the packages will se lf align when subjected to a solder reflow process. it is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. figure 4. sop footprint (case 1369) minimum recommended footprint for super small outline package surface mount board la yout is a critical portion of the total design. the footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. with the correct pad geometry, the packages will self-align when subjected to a solder reflow process. it is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. figure 5. ssop footprint (case 1317a) part number case type pressure (p1) side identifier mpxh6400ac6u 1317a side with port attached MPXH6400AC6T1 1317a side with port attached mpxhz6400ac6t1 1317a side with port attached mpxa6400ap 1369 side with port attached 0.660 16.76 0.060 typ 8x 1.52 0.100 typ 8x 2.54 0.100 typ 8x 2.54 0.300 7.62 inch mm scale 2:1 0.027 typ 8x 0.69 0.053 typ 8x 1.35 inch mm 0.387 9.83 0.150 3.81 0.050 1.27 typ
mpxh6400a sensors freescale semiconductor 7 pressure package dimensions case 1317a-04 issue d super small outline package page 1 of 2
mpxh6400a sensors 8 freescale semiconductor pressure package dimensions case 1317a-04 issue d super small outline package page 2 of 2
mpxh6400a sensors freescale semiconductor 9 pressure package dimensions case 1369-01 issue b small outline package page 1 of 2
mpxh6400a sensors 10 freescale semiconductor pressure package dimensions case 1369-01 issue b small outline package page 2 of 2
mpxh6400a rev. 4 11/2009 how to reach us: home page: www.freescale.com web support: http://www.freescale.com/support usa/europe or locations not listed: freescale semiconductor, inc. technical information center, el516 2100 east elliot road tempe, arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support europe, middle east, and africa: freescale halbleiter deutschland gmbh technical information center schatzbogen 7 81829 muenchen, germany +44 1296 380 456 (english) +46 8 52200080 (english) +49 89 92103 559 (german) +33 1 69 35 48 48 (french) www.freescale.com/support japan: freescale semiconductor japan ltd. headquarters arco tower 15f 1-8-1, shimo-meguro, meguro-ku, tokyo 153-0064 japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com asia/pacific: freescale semiconductor china ltd. exchange building 23f no. 118 jianguo road chaoyang district beijing 100022 china +86 10 5879 8000 support.asia@freescale.com for literature requests only: freescale semiconductor lite rature distribution center 1-800-441-2447 or +1-303-675-2140 fax: +1-303-675-2150 ldcforfreescalesemiconductor@hibbertgroup.com information in this document is provided solely to enable system and software implementers to use freescale semiconduc tor products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. freescale semiconductor reserves the right to make changes without further notice to any products herein. freescale semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does freescale semiconductor assume any liability ar ising out of the application or use of any product or circuit, and specifically discl aims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale semiconductor data s heets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. freescale se miconductor does not convey any license under its patent rights nor the rights of others. freescale semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the fa ilure of the freescale semiconductor product could create a situation where personal injury or death may occur. should buyer purchase or use freescale semiconductor products for any such unintended or unauthorized application, buyer shall indemni fy and hold freescale semiconductor and its officers, employees, subsidiaries, affili ates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that freescale semiconductor was negligent regarding the design or manufacture of the part. freescale? and the freescale logo are trademarks of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? freescale semiconductor, inc. 2009. all rights reserved.

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